JPS5731845U - - Google Patents

Info

Publication number
JPS5731845U
JPS5731845U JP10745880U JP10745880U JPS5731845U JP S5731845 U JPS5731845 U JP S5731845U JP 10745880 U JP10745880 U JP 10745880U JP 10745880 U JP10745880 U JP 10745880U JP S5731845 U JPS5731845 U JP S5731845U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10745880U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10745880U priority Critical patent/JPS5731845U/ja
Publication of JPS5731845U publication Critical patent/JPS5731845U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05073—Single internal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP10745880U 1980-07-28 1980-07-28 Pending JPS5731845U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10745880U JPS5731845U (enrdf_load_stackoverflow) 1980-07-28 1980-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10745880U JPS5731845U (enrdf_load_stackoverflow) 1980-07-28 1980-07-28

Publications (1)

Publication Number Publication Date
JPS5731845U true JPS5731845U (enrdf_load_stackoverflow) 1982-02-19

Family

ID=29468760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10745880U Pending JPS5731845U (enrdf_load_stackoverflow) 1980-07-28 1980-07-28

Country Status (1)

Country Link
JP (1) JPS5731845U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026015U (enrdf_load_stackoverflow) * 1988-06-28 1990-01-16
JPH0529515U (ja) * 1991-10-04 1993-04-20 昭一 藤江 歯の衛生用小楊枝

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026015U (enrdf_load_stackoverflow) * 1988-06-28 1990-01-16
JPH0529515U (ja) * 1991-10-04 1993-04-20 昭一 藤江 歯の衛生用小楊枝

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