JPS5731298B2 - - Google Patents
Info
- Publication number
- JPS5731298B2 JPS5731298B2 JP4595474A JP4595474A JPS5731298B2 JP S5731298 B2 JPS5731298 B2 JP S5731298B2 JP 4595474 A JP4595474 A JP 4595474A JP 4595474 A JP4595474 A JP 4595474A JP S5731298 B2 JPS5731298 B2 JP S5731298B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4595474A JPS5731298B2 (en) | 1974-04-25 | 1974-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4595474A JPS5731298B2 (en) | 1974-04-25 | 1974-04-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17605781A Division JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50139671A JPS50139671A (en) | 1975-11-08 |
| JPS5731298B2 true JPS5731298B2 (en) | 1982-07-03 |
Family
ID=12733659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4595474A Expired JPS5731298B2 (en) | 1974-04-25 | 1974-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5731298B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143835A (en) * | 1981-02-27 | 1982-09-06 | Citizen Watch Co Ltd | Mounting method of ic |
| JPS63291445A (en) * | 1987-05-23 | 1988-11-29 | Fuji Plant Kogyo Kk | Dichroic selective plating on lead frame |
| KR0165883B1 (en) * | 1988-09-16 | 1999-02-01 | 존 엠. 클락 | Gold/tin eutectic bonding for tape automated process |
-
1974
- 1974-04-25 JP JP4595474A patent/JPS5731298B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50139671A (en) | 1975-11-08 |