JPS5731131A - Baking method - Google Patents

Baking method

Info

Publication number
JPS5731131A
JPS5731131A JP10499980A JP10499980A JPS5731131A JP S5731131 A JPS5731131 A JP S5731131A JP 10499980 A JP10499980 A JP 10499980A JP 10499980 A JP10499980 A JP 10499980A JP S5731131 A JPS5731131 A JP S5731131A
Authority
JP
Japan
Prior art keywords
wafers
furnace
belt
length
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10499980A
Other languages
Japanese (ja)
Inventor
Hiromi Yukita
Seikichi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10499980A priority Critical patent/JPS5731131A/en
Publication of JPS5731131A publication Critical patent/JPS5731131A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To shorten furnace length by intermittently moving wafers in a baking furnace while wafers are maintained at upright attitude. CONSTITUTION:When the wafers 1 are inserted into attachments 5 mounted on a belt 2 in three rows, the wafers are erected. The wafers are moved intermittently in the furnace 3 as they are maintained at upright attitude. The velt 2 is kept clean at all times by means of a wahsing unit 6. The wafers are supplied to and taken out of the furnace 3 during the stoppage of the belt. According to this constitution, a large number of the wafers can be baked on the same belt length as compared with the horizontal arrangement of the wafers, and the furnace length is shortened largely when a dust level of washing is the same with each other.
JP10499980A 1980-08-01 1980-08-01 Baking method Pending JPS5731131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10499980A JPS5731131A (en) 1980-08-01 1980-08-01 Baking method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10499980A JPS5731131A (en) 1980-08-01 1980-08-01 Baking method

Publications (1)

Publication Number Publication Date
JPS5731131A true JPS5731131A (en) 1982-02-19

Family

ID=14395786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10499980A Pending JPS5731131A (en) 1980-08-01 1980-08-01 Baking method

Country Status (1)

Country Link
JP (1) JPS5731131A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911641A (en) * 1982-07-12 1984-01-21 Hitachi Ltd Device for heat treatment
JPS59119738A (en) * 1982-12-24 1984-07-11 Toshiba Corp Manufacturing device for semiconductor device
JPS6073634A (en) * 1983-09-30 1985-04-25 Fuji Xerox Co Ltd Display controller of numer of copies for electronic copying machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911641A (en) * 1982-07-12 1984-01-21 Hitachi Ltd Device for heat treatment
JPS59119738A (en) * 1982-12-24 1984-07-11 Toshiba Corp Manufacturing device for semiconductor device
JPS6073634A (en) * 1983-09-30 1985-04-25 Fuji Xerox Co Ltd Display controller of numer of copies for electronic copying machine

Similar Documents

Publication Publication Date Title
JPS57194841A (en) Automatic assembling device
GB1531681A (en) Amides of pyrimido(4,5-b)quinolin-4(3h)-one-2-carboxylic acids as antiulcer agents
JPS5731131A (en) Baking method
JPS56117905A (en) Conveyor
JPS5415279A (en) Conveyor apparatus
JPS648150A (en) Conveying device
JPS5421696A (en) N.c. lathe and processing method making use of the same
JPS5343371A (en) Assorting apparatus in use of air jet
JPS51145696A (en) Method of raising collecting and packing flat articles arranged in a p lural number of lines
JPS6480469A (en) Substrate carrying in/out device of substrate baking device
JPS5438075A (en) Device for loading and unloading article
JPS5371565A (en) Reticule washing equipment
JPS5415280A (en) Conveyor apparatus
JPS5396265A (en) Automatic article washing apparatus
JPS5237185A (en) Encasing method of plate-like articles
JPS5212252A (en) Process for electrostatic flocking
JPS5279491A (en) Overhead conveyor
JPS5221945A (en) Method and apparatus to circulate balls in a pin ball machine
JPS52107898A (en) Jey-type molecuel separator
JPS54153495A (en) Device for assembling blocks of hull
JPS57117412A (en) Equipment for automatically mounting and feeding material to be treated
JPS55106911A (en) Chain conveyor with basket
JPS57117410A (en) Conveyor for annular article
JPS51151402A (en) An improved deflator
JPS51151671A (en) Transfer method at batch treatment in horizontal tanks