JPS5730866Y2 - - Google Patents
Info
- Publication number
- JPS5730866Y2 JPS5730866Y2 JP1974135378U JP13537874U JPS5730866Y2 JP S5730866 Y2 JPS5730866 Y2 JP S5730866Y2 JP 1974135378 U JP1974135378 U JP 1974135378U JP 13537874 U JP13537874 U JP 13537874U JP S5730866 Y2 JPS5730866 Y2 JP S5730866Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1974135378U JPS5730866Y2 (ja) | 1974-11-07 | 1974-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1974135378U JPS5730866Y2 (ja) | 1974-11-07 | 1974-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5160768U JPS5160768U (ja) | 1976-05-13 |
JPS5730866Y2 true JPS5730866Y2 (ja) | 1982-07-07 |
Family
ID=28403848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1974135378U Expired JPS5730866Y2 (ja) | 1974-11-07 | 1974-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5730866Y2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5394795A (en) * | 1977-01-29 | 1978-08-19 | Toshiba Corp | Liminous display unit |
JP5077282B2 (ja) * | 2002-08-30 | 2012-11-21 | 日亜化学工業株式会社 | 発光素子搭載用パッケージおよび発光装置 |
JP2005019688A (ja) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP5844249B2 (ja) * | 2012-12-27 | 2016-01-13 | 株式会社ケー・シー・シー・商会 | Led表示装置用リフレクタ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4895571U (ja) * | 1972-02-16 | 1973-11-14 | ||
JPS5124859Y2 (ja) * | 1972-02-28 | 1976-06-25 |
-
1974
- 1974-11-07 JP JP1974135378U patent/JPS5730866Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5160768U (ja) | 1976-05-13 |