JPS5729319Y2 - - Google Patents
Info
- Publication number
- JPS5729319Y2 JPS5729319Y2 JP1975164574U JP16457475U JPS5729319Y2 JP S5729319 Y2 JPS5729319 Y2 JP S5729319Y2 JP 1975164574 U JP1975164574 U JP 1975164574U JP 16457475 U JP16457475 U JP 16457475U JP S5729319 Y2 JPS5729319 Y2 JP S5729319Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975164574U JPS5729319Y2 (enExample) | 1975-12-04 | 1975-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975164574U JPS5729319Y2 (enExample) | 1975-12-04 | 1975-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5276270U JPS5276270U (enExample) | 1977-06-07 |
| JPS5729319Y2 true JPS5729319Y2 (enExample) | 1982-06-26 |
Family
ID=28643348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975164574U Expired JPS5729319Y2 (enExample) | 1975-12-04 | 1975-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5729319Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331409Y2 (enExample) * | 1981-06-03 | 1988-08-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4929974A (enExample) * | 1972-07-19 | 1974-03-16 |
-
1975
- 1975-12-04 JP JP1975164574U patent/JPS5729319Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5276270U (enExample) | 1977-06-07 |