JPS5729056B2 - - Google Patents
Info
- Publication number
- JPS5729056B2 JPS5729056B2 JP1622274A JP1622274A JPS5729056B2 JP S5729056 B2 JPS5729056 B2 JP S5729056B2 JP 1622274 A JP1622274 A JP 1622274A JP 1622274 A JP1622274 A JP 1622274A JP S5729056 B2 JPS5729056 B2 JP S5729056B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1622274A JPS5729056B2 (OSRAM) | 1974-02-12 | 1974-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1622274A JPS5729056B2 (OSRAM) | 1974-02-12 | 1974-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50111990A JPS50111990A (OSRAM) | 1975-09-03 |
| JPS5729056B2 true JPS5729056B2 (OSRAM) | 1982-06-21 |
Family
ID=11910491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1622274A Expired JPS5729056B2 (OSRAM) | 1974-02-12 | 1974-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5729056B2 (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5846663A (ja) * | 1981-08-29 | 1983-03-18 | ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 半導体ダイオ−ド薄片を有する整流装置 |
-
1974
- 1974-02-12 JP JP1622274A patent/JPS5729056B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50111990A (OSRAM) | 1975-09-03 |