JPS5728952B2 - - Google Patents
Info
- Publication number
- JPS5728952B2 JPS5728952B2 JP13515874A JP13515874A JPS5728952B2 JP S5728952 B2 JPS5728952 B2 JP S5728952B2 JP 13515874 A JP13515874 A JP 13515874A JP 13515874 A JP13515874 A JP 13515874A JP S5728952 B2 JPS5728952 B2 JP S5728952B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515874A JPS5728952B2 (https=) | 1974-11-26 | 1974-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515874A JPS5728952B2 (https=) | 1974-11-26 | 1974-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5161264A JPS5161264A (https=) | 1976-05-27 |
| JPS5728952B2 true JPS5728952B2 (https=) | 1982-06-19 |
Family
ID=15145160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13515874A Expired JPS5728952B2 (https=) | 1974-11-26 | 1974-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5728952B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442476U (https=) * | 1977-08-30 | 1979-03-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3784884A (en) * | 1972-11-03 | 1974-01-08 | Motorola Inc | Low parasitic microwave package |
-
1974
- 1974-11-26 JP JP13515874A patent/JPS5728952B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5161264A (https=) | 1976-05-27 |