JPS5728952B2 - - Google Patents
Info
- Publication number
- JPS5728952B2 JPS5728952B2 JP13515874A JP13515874A JPS5728952B2 JP S5728952 B2 JPS5728952 B2 JP S5728952B2 JP 13515874 A JP13515874 A JP 13515874A JP 13515874 A JP13515874 A JP 13515874A JP S5728952 B2 JPS5728952 B2 JP S5728952B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515874A JPS5728952B2 (cg-RX-API-DMAC7.html) | 1974-11-26 | 1974-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515874A JPS5728952B2 (cg-RX-API-DMAC7.html) | 1974-11-26 | 1974-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5161264A JPS5161264A (cg-RX-API-DMAC7.html) | 1976-05-27 |
| JPS5728952B2 true JPS5728952B2 (cg-RX-API-DMAC7.html) | 1982-06-19 |
Family
ID=15145160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13515874A Expired JPS5728952B2 (cg-RX-API-DMAC7.html) | 1974-11-26 | 1974-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5728952B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442476U (cg-RX-API-DMAC7.html) * | 1977-08-30 | 1979-03-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3784884A (en) * | 1972-11-03 | 1974-01-08 | Motorola Inc | Low parasitic microwave package |
-
1974
- 1974-11-26 JP JP13515874A patent/JPS5728952B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5161264A (cg-RX-API-DMAC7.html) | 1976-05-27 |