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Filing date
Publication date
Application filedfiledCritical
Priority to JP1976031233UpriorityCriticalpatent/JPS5727166Y2/ja
Publication of JPS52122667UpublicationCriticalpatent/JPS52122667U/ja
Application grantedgrantedCritical
Publication of JPS5727166Y2publicationCriticalpatent/JPS5727166Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
Wire Bonding
(AREA)
Testing Or Measuring Of Semiconductors Or The Like
(AREA)