JPS5726449A - Attachment of pellet and device therefor - Google Patents

Attachment of pellet and device therefor

Info

Publication number
JPS5726449A
JPS5726449A JP9994580A JP9994580A JPS5726449A JP S5726449 A JPS5726449 A JP S5726449A JP 9994580 A JP9994580 A JP 9994580A JP 9994580 A JP9994580 A JP 9994580A JP S5726449 A JPS5726449 A JP S5726449A
Authority
JP
Japan
Prior art keywords
pellet
scrubbing
period
attachment
crack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9994580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6328340B2 (enrdf_load_html_response
Inventor
Tatsuo Sugimoto
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9994580A priority Critical patent/JPS5726449A/ja
Publication of JPS5726449A publication Critical patent/JPS5726449A/ja
Publication of JPS6328340B2 publication Critical patent/JPS6328340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9994580A 1980-07-23 1980-07-23 Attachment of pellet and device therefor Granted JPS5726449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9994580A JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9994580A JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Publications (2)

Publication Number Publication Date
JPS5726449A true JPS5726449A (en) 1982-02-12
JPS6328340B2 JPS6328340B2 (enrdf_load_html_response) 1988-06-08

Family

ID=14260838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9994580A Granted JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Country Status (1)

Country Link
JP (1) JPS5726449A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124944A (ja) * 1983-12-12 1985-07-04 Marine Instr Co Ltd ダイボンデイング方法
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54136178A (en) * 1978-04-13 1979-10-23 Toshiba Corp Chip mounting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54136178A (en) * 1978-04-13 1979-10-23 Toshiba Corp Chip mounting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124944A (ja) * 1983-12-12 1985-07-04 Marine Instr Co Ltd ダイボンデイング方法
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Also Published As

Publication number Publication date
JPS6328340B2 (enrdf_load_html_response) 1988-06-08

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