JPS572532A - Tray for lead frame - Google Patents

Tray for lead frame

Info

Publication number
JPS572532A
JPS572532A JP7644580A JP7644580A JPS572532A JP S572532 A JPS572532 A JP S572532A JP 7644580 A JP7644580 A JP 7644580A JP 7644580 A JP7644580 A JP 7644580A JP S572532 A JPS572532 A JP S572532A
Authority
JP
Japan
Prior art keywords
lead frame
grooves
tray
racks
confronting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7644580A
Other languages
Japanese (ja)
Inventor
Kojiro Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7644580A priority Critical patent/JPS572532A/en
Publication of JPS572532A publication Critical patent/JPS572532A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE:To prevent the occurrence of a malfunction of a bonded lead frame due to vibration by forming a bridged racks between confronting grooves of a tray for a lead frame having right and left side walls having a plurality of horizontal grooves. CONSTITUTION:Grooves 23 extending horizontally are so formed on the confronting surfaces of confronting right and left side rectangular walls 21, 22 as to confront each other in such a manner that the interval between the walls 21 and 22 is maintained constantly via upper and lower rectangular plates 25, 26, racks 29 are inserted into the respective grooves 23, and lead frames are placed on the respective racks 29. Thus, even if the tray is vibrated, the vibration of the lead externally led of the lead frame can be eliminated, and the crack and fracture of the bonded wire can be prevented.
JP7644580A 1980-06-06 1980-06-06 Tray for lead frame Pending JPS572532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7644580A JPS572532A (en) 1980-06-06 1980-06-06 Tray for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7644580A JPS572532A (en) 1980-06-06 1980-06-06 Tray for lead frame

Publications (1)

Publication Number Publication Date
JPS572532A true JPS572532A (en) 1982-01-07

Family

ID=13605345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7644580A Pending JPS572532A (en) 1980-06-06 1980-06-06 Tray for lead frame

Country Status (1)

Country Link
JP (1) JPS572532A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100394774B1 (en) * 1999-12-10 2003-08-19 앰코 테크놀로지 코리아 주식회사 magazine for semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100394774B1 (en) * 1999-12-10 2003-08-19 앰코 테크놀로지 코리아 주식회사 magazine for semiconductor

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