JPS5722452Y2 - - Google Patents

Info

Publication number
JPS5722452Y2
JPS5722452Y2 JP1975175780U JP17578075U JPS5722452Y2 JP S5722452 Y2 JPS5722452 Y2 JP S5722452Y2 JP 1975175780 U JP1975175780 U JP 1975175780U JP 17578075 U JP17578075 U JP 17578075U JP S5722452 Y2 JPS5722452 Y2 JP S5722452Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975175780U
Other languages
Japanese (ja)
Other versions
JPS5286362U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975175780U priority Critical patent/JPS5722452Y2/ja
Publication of JPS5286362U publication Critical patent/JPS5286362U/ja
Application granted granted Critical
Publication of JPS5722452Y2 publication Critical patent/JPS5722452Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP1975175780U 1975-12-24 1975-12-24 Expired JPS5722452Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975175780U JPS5722452Y2 (enrdf_load_stackoverflow) 1975-12-24 1975-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975175780U JPS5722452Y2 (enrdf_load_stackoverflow) 1975-12-24 1975-12-24

Publications (2)

Publication Number Publication Date
JPS5286362U JPS5286362U (enrdf_load_stackoverflow) 1977-06-28
JPS5722452Y2 true JPS5722452Y2 (enrdf_load_stackoverflow) 1982-05-15

Family

ID=28654118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975175780U Expired JPS5722452Y2 (enrdf_load_stackoverflow) 1975-12-24 1975-12-24

Country Status (1)

Country Link
JP (1) JPS5722452Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5286362U (enrdf_load_stackoverflow) 1977-06-28

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