JPS5722452Y2 - - Google Patents

Info

Publication number
JPS5722452Y2
JPS5722452Y2 JP1975175780U JP17578075U JPS5722452Y2 JP S5722452 Y2 JPS5722452 Y2 JP S5722452Y2 JP 1975175780 U JP1975175780 U JP 1975175780U JP 17578075 U JP17578075 U JP 17578075U JP S5722452 Y2 JPS5722452 Y2 JP S5722452Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975175780U
Other languages
Japanese (ja)
Other versions
JPS5286362U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975175780U priority Critical patent/JPS5722452Y2/ja
Publication of JPS5286362U publication Critical patent/JPS5286362U/ja
Application granted granted Critical
Publication of JPS5722452Y2 publication Critical patent/JPS5722452Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP1975175780U 1975-12-24 1975-12-24 Expired JPS5722452Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975175780U JPS5722452Y2 (cs) 1975-12-24 1975-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975175780U JPS5722452Y2 (cs) 1975-12-24 1975-12-24

Publications (2)

Publication Number Publication Date
JPS5286362U JPS5286362U (cs) 1977-06-28
JPS5722452Y2 true JPS5722452Y2 (cs) 1982-05-15

Family

ID=28654118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975175780U Expired JPS5722452Y2 (cs) 1975-12-24 1975-12-24

Country Status (1)

Country Link
JP (1) JPS5722452Y2 (cs)

Also Published As

Publication number Publication date
JPS5286362U (cs) 1977-06-28

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