JPS5722418B2 - - Google Patents

Info

Publication number
JPS5722418B2
JPS5722418B2 JP11035179A JP11035179A JPS5722418B2 JP S5722418 B2 JPS5722418 B2 JP S5722418B2 JP 11035179 A JP11035179 A JP 11035179A JP 11035179 A JP11035179 A JP 11035179A JP S5722418 B2 JPS5722418 B2 JP S5722418B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11035179A
Other languages
Japanese (ja)
Other versions
JPS5635440A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11035179A priority Critical patent/JPS5635440A/en
Publication of JPS5635440A publication Critical patent/JPS5635440A/en
Publication of JPS5722418B2 publication Critical patent/JPS5722418B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP11035179A 1979-08-31 1979-08-31 Semiconductor device Granted JPS5635440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11035179A JPS5635440A (en) 1979-08-31 1979-08-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11035179A JPS5635440A (en) 1979-08-31 1979-08-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5635440A JPS5635440A (en) 1981-04-08
JPS5722418B2 true JPS5722418B2 (en) 1982-05-13

Family

ID=14533555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11035179A Granted JPS5635440A (en) 1979-08-31 1979-08-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5635440A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604859A (en) * 1983-06-22 1985-01-11 Lion Corp Foul breath examining test element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425164A (en) * 1977-07-28 1979-02-24 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425164A (en) * 1977-07-28 1979-02-24 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5635440A (en) 1981-04-08

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