JPS57211753A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPS57211753A JPS57211753A JP56096681A JP9668181A JPS57211753A JP S57211753 A JPS57211753 A JP S57211753A JP 56096681 A JP56096681 A JP 56096681A JP 9668181 A JP9668181 A JP 9668181A JP S57211753 A JPS57211753 A JP S57211753A
- Authority
- JP
- Japan
- Prior art keywords
- marks
- printed
- curved surface
- electronic parts
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56096681A JPS57211753A (en) | 1981-06-24 | 1981-06-24 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56096681A JPS57211753A (en) | 1981-06-24 | 1981-06-24 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57211753A true JPS57211753A (en) | 1982-12-25 |
Family
ID=14171528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56096681A Pending JPS57211753A (en) | 1981-06-24 | 1981-06-24 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211753A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105212A (ja) * | 1983-11-11 | 1985-06-10 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
-
1981
- 1981-06-24 JP JP56096681A patent/JPS57211753A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105212A (ja) * | 1983-11-11 | 1985-06-10 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
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