JPS5720708B2 - - Google Patents

Info

Publication number
JPS5720708B2
JPS5720708B2 JP7992373A JP7992373A JPS5720708B2 JP S5720708 B2 JPS5720708 B2 JP S5720708B2 JP 7992373 A JP7992373 A JP 7992373A JP 7992373 A JP7992373 A JP 7992373A JP S5720708 B2 JPS5720708 B2 JP S5720708B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7992373A
Other versions
JPS5029161A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7992373A priority Critical patent/JPS5720708B2/ja
Publication of JPS5029161A publication Critical patent/JPS5029161A/ja
Publication of JPS5720708B2 publication Critical patent/JPS5720708B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP7992373A 1973-07-17 1973-07-17 Expired JPS5720708B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7992373A JPS5720708B2 (ja) 1973-07-17 1973-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7992373A JPS5720708B2 (ja) 1973-07-17 1973-07-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56032615A Division JPS5827660B2 (ja) 1981-03-09 1981-03-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS5029161A JPS5029161A (ja) 1975-03-25
JPS5720708B2 true JPS5720708B2 (ja) 1982-04-30

Family

ID=13703810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7992373A Expired JPS5720708B2 (ja) 1973-07-17 1973-07-17

Country Status (1)

Country Link
JP (1) JPS5720708B2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933979B2 (ja) * 1975-07-16 1984-08-20 株式会社東芝 半導体装置
JPS52145802A (en) * 1976-05-31 1977-12-05 Hitachi Ltd Screw pump rotor
JPS59206689A (ja) * 1983-05-10 1984-11-22 Oval Eng Co Ltd 連続接触歯車ポンプ
JPS61129489A (ja) * 1985-07-20 1986-06-17 Tokico Ltd スクリユ−式流体機械

Also Published As

Publication number Publication date
JPS5029161A (ja) 1975-03-25

Similar Documents

Publication Publication Date Title
AU476761B2 (ja)
AR201231Q (ja)
AU474593B2 (ja)
AU474511B2 (ja)
AU474838B2 (ja)
AU476714B2 (ja)
AR201229Q (ja)
AU476696B2 (ja)
AU472848B2 (ja)
JPS5720708B2 (ja)
AU477823B2 (ja)
AR200885A1 (ja)
AU471461B2 (ja)
AR193950A1 (ja)
AR195311A1 (ja)
AR195948A1 (ja)
AR196382A1 (ja)
AR197627A1 (ja)
AU476873B1 (ja)
AR200256A1 (ja)
AU477824B2 (ja)
AR196123Q (ja)
AR196212Q (ja)
BG20005A1 (ja)
AU479751A (ja)