JPS57205944A - Method of producing structure by electrolysis and corrosion - Google Patents

Method of producing structure by electrolysis and corrosion

Info

Publication number
JPS57205944A
JPS57205944A JP7594282A JP7594282A JPS57205944A JP S57205944 A JPS57205944 A JP S57205944A JP 7594282 A JP7594282 A JP 7594282A JP 7594282 A JP7594282 A JP 7594282A JP S57205944 A JPS57205944 A JP S57205944A
Authority
JP
Japan
Prior art keywords
electrolysis
corrosion
producing structure
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7594282A
Other languages
Japanese (ja)
Inventor
Toraushiyu Giyuntaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of JPS57205944A publication Critical patent/JPS57205944A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • ing And Chemical Polishing (AREA)
JP7594282A 1981-05-08 1982-05-06 Method of producing structure by electrolysis and corrosion Pending JPS57205944A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813118335 DE3118335A1 (en) 1981-05-08 1981-05-08 Method of structuring (patterning) plates with insulating annular zones in the vicinity of the openings of holes by electroplating and etching

Publications (1)

Publication Number Publication Date
JPS57205944A true JPS57205944A (en) 1982-12-17

Family

ID=6131821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7594282A Pending JPS57205944A (en) 1981-05-08 1982-05-06 Method of producing structure by electrolysis and corrosion

Country Status (2)

Country Link
JP (1) JPS57205944A (en)
DE (1) DE3118335A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3237925A1 (en) * 1982-10-13 1984-04-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Process for the production of a halftone channel plate
DE3517730A1 (en) * 1985-05-17 1986-11-20 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe METHOD FOR PRODUCING SPINNING NOZZLE PLATES
DE3517729A1 (en) * 1985-05-17 1986-11-20 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe METHOD FOR PRODUCING SPINNING NOZZLE PLATES
DE4042125A1 (en) * 1990-12-28 1992-07-02 Maxs Ag METHOD FOR PRODUCING A REINFORCED FLAT OBJECT HAVING MICRO-OPENINGS

Also Published As

Publication number Publication date
DE3118335A1 (en) 1982-11-25

Similar Documents

Publication Publication Date Title
DE3277460D1 (en) Corrosion resistant steel components and method of manufacture
JPS57147240A (en) Method of producing extrefine structure
YU302681A (en) Method of producing electrolytic contacts
JPS57202609A (en) Integral structure and method of producing same
EP0229325A3 (en) Corrosion resistant steel components and method of manufacture
JPS57205944A (en) Method of producing structure by electrolysis and corrosion
GB2091235B (en) Method of producing corrosion inhibitors
JPS57128917A (en) Electrolytic condenser and method of producing same
JPS57145210A (en) Method of producing conductive member
JPS57136791A (en) Method of producing quali-fuel rod
JPS57202722A (en) Method of producing electrolytic condenser
JPS57208123A (en) Method of producing solid electrolytic condenser
JPS57173928A (en) Method of producing solid electrolytic condenser
DE3260421D1 (en) Method of producing cement
JPS57115816A (en) Method of producing composite part
JPS57136710A (en) Method of producing flat cable
JPS57182974A (en) Method of producing electrode
JPS57136792A (en) Method of producing quali-fuel rod
JPS57207326A (en) Method of producing electrolytic condenser
JPS57170514A (en) Method of producing solid electrolytic condenser
JPS57149719A (en) Method of producing solid electrolytic condenser
JPS57181173A (en) Method of producing rectifier
JPS56138888A (en) Method of producing interconnector
SU1009052A1 (en) Method of producing 2-nitrodibenzo-p-dioxin
SU1279533A1 (en) Method of producing polyhexamethylenadipamide