JPS57203573U - - Google Patents
Info
- Publication number
- JPS57203573U JPS57203573U JP1981092525U JP9252581U JPS57203573U JP S57203573 U JPS57203573 U JP S57203573U JP 1981092525 U JP1981092525 U JP 1981092525U JP 9252581 U JP9252581 U JP 9252581U JP S57203573 U JPS57203573 U JP S57203573U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981092525U JPS57203573U (ja) | 1981-06-23 | 1981-06-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981092525U JPS57203573U (ja) | 1981-06-23 | 1981-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57203573U true JPS57203573U (ja) | 1982-12-24 |
Family
ID=29887555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981092525U Pending JPS57203573U (ja) | 1981-06-23 | 1981-06-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57203573U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109343U (ja) * | 1983-09-20 | 1985-07-25 | キムラ電機株式会社 | Led表示灯取付用プラグ式口金 |
JP2010212513A (ja) * | 2009-03-11 | 2010-09-24 | Japan Aviation Electronics Industry Ltd | 光半導体デバイス、ソケットおよび光半導体ユニット |
-
1981
- 1981-06-23 JP JP1981092525U patent/JPS57203573U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109343U (ja) * | 1983-09-20 | 1985-07-25 | キムラ電機株式会社 | Led表示灯取付用プラグ式口金 |
JP2010212513A (ja) * | 2009-03-11 | 2010-09-24 | Japan Aviation Electronics Industry Ltd | 光半導体デバイス、ソケットおよび光半導体ユニット |
US9152755B2 (en) | 2009-03-11 | 2015-10-06 | Japan Aviation Electronics Industry, Limited | Optical semiconductor device, socket, and optical semiconductor unit |