JPS57201171A - Polishing device - Google Patents

Polishing device

Info

Publication number
JPS57201171A
JPS57201171A JP8543181A JP8543181A JPS57201171A JP S57201171 A JPS57201171 A JP S57201171A JP 8543181 A JP8543181 A JP 8543181A JP 8543181 A JP8543181 A JP 8543181A JP S57201171 A JPS57201171 A JP S57201171A
Authority
JP
Japan
Prior art keywords
liquid detergent
liquid
central portion
detergent
injecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8543181A
Other languages
Japanese (ja)
Inventor
Yoshimi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meinan Machinery Works Inc
Meinan Seisakusho KK
Original Assignee
Meinan Machinery Works Inc
Meinan Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meinan Machinery Works Inc, Meinan Seisakusho KK filed Critical Meinan Machinery Works Inc
Priority to JP8543181A priority Critical patent/JPS57201171A/en
Publication of JPS57201171A publication Critical patent/JPS57201171A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/10—Devices or means for dressing or conditioning abrasive surfaces of travelling flexible backings coated with abrasives; Cleaning of abrasive belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE:To recover positively surplus liquid detergent for removing polishing powder attached to a grain surface by injecting the liquid detergent to the central side of a polishing belt to centralize the surplus liquid detergent in the central portion and removing the liquid from the detergent. CONSTITUTION:Liquid detergent injection nozzles 7, 8 are arranged to be directed from the side end toward the central portion in the direction orthogonal to the rotary direction of a polishing belt 5 for injecting the liquid detergent. Thus, injected liquid detergent is centralized in the central portion and removed completely by a removing member such as press roll 9 to be accumulated in a liquid collecting device 10. Thus, the liquid detergent is dropped from the side end of the belt 5 by its own weight without acting on a work W below.
JP8543181A 1981-06-02 1981-06-02 Polishing device Pending JPS57201171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8543181A JPS57201171A (en) 1981-06-02 1981-06-02 Polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8543181A JPS57201171A (en) 1981-06-02 1981-06-02 Polishing device

Publications (1)

Publication Number Publication Date
JPS57201171A true JPS57201171A (en) 1982-12-09

Family

ID=13858647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8543181A Pending JPS57201171A (en) 1981-06-02 1981-06-02 Polishing device

Country Status (1)

Country Link
JP (1) JPS57201171A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254663A (en) * 1985-08-30 1987-03-10 Takegawa Tekko Kk Wet type sander machine
US5126819A (en) * 1989-11-10 1992-06-30 Kabushiki Kaisha Toshiba Wiring pattern of semiconductor integrated circuit device
DE102011002808A1 (en) * 2011-01-18 2012-07-19 Bütfering Schleiftechnik GmbH Bandabblasvorrichtung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254663A (en) * 1985-08-30 1987-03-10 Takegawa Tekko Kk Wet type sander machine
US5126819A (en) * 1989-11-10 1992-06-30 Kabushiki Kaisha Toshiba Wiring pattern of semiconductor integrated circuit device
US5523627A (en) * 1989-11-10 1996-06-04 Kabushiki Kaisha Toshiba Wiring pattern of semiconductor integrated circuit device
USRE37059E1 (en) * 1989-11-10 2001-02-20 Kabushiki Kaisha Toshiba Wiring pattern of semiconductor integrated circuit device
DE102011002808A1 (en) * 2011-01-18 2012-07-19 Bütfering Schleiftechnik GmbH Bandabblasvorrichtung

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