JPS57201086U - - Google Patents

Info

Publication number
JPS57201086U
JPS57201086U JP1981088483U JP8848381U JPS57201086U JP S57201086 U JPS57201086 U JP S57201086U JP 1981088483 U JP1981088483 U JP 1981088483U JP 8848381 U JP8848381 U JP 8848381U JP S57201086 U JPS57201086 U JP S57201086U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981088483U
Other languages
Japanese (ja)
Other versions
JPS6311906Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981088483U priority Critical patent/JPS6311906Y2/ja
Priority to CA000404932A priority patent/CA1190597A/en
Priority to US06/387,893 priority patent/US4460956A/en
Priority to BR8203468A priority patent/BR8203468A/pt
Priority to AU84872/82A priority patent/AU555934B2/en
Publication of JPS57201086U publication Critical patent/JPS57201086U/ja
Application granted granted Critical
Publication of JPS6311906Y2 publication Critical patent/JPS6311906Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62Protection against overvoltage, e.g. fuses, shunts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1981088483U 1981-06-15 1981-06-15 Expired JPS6311906Y2 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1981088483U JPS6311906Y2 (enExample) 1981-06-15 1981-06-15
CA000404932A CA1190597A (en) 1981-06-15 1982-06-11 Rectifying device
US06/387,893 US4460956A (en) 1981-06-15 1982-06-14 Rectifying device
BR8203468A BR8203468A (pt) 1981-06-15 1982-06-14 Dispositivo de retificacao
AU84872/82A AU555934B2 (en) 1981-06-15 1982-06-15 Cooling means for rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981088483U JPS6311906Y2 (enExample) 1981-06-15 1981-06-15

Publications (2)

Publication Number Publication Date
JPS57201086U true JPS57201086U (enExample) 1982-12-21
JPS6311906Y2 JPS6311906Y2 (enExample) 1988-04-06

Family

ID=13944035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981088483U Expired JPS6311906Y2 (enExample) 1981-06-15 1981-06-15

Country Status (5)

Country Link
US (1) US4460956A (enExample)
JP (1) JPS6311906Y2 (enExample)
AU (1) AU555934B2 (enExample)
BR (1) BR8203468A (enExample)
CA (1) CA1190597A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147961A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 電子機器冷却装置およびこれを備える電力変換装置
WO2014147963A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 冷却装置及びこれを備えた電力変換装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606000A (en) * 1985-03-27 1986-08-12 General Motors Corporation Bridge rectifier
US4684875A (en) * 1986-04-28 1987-08-04 Liebert Corporation Power conditioning system and apparatus
JPS6381691U (enExample) * 1986-11-14 1988-05-30
JPS63159894U (enExample) * 1987-04-08 1988-10-19
US6160696A (en) * 1998-05-04 2000-12-12 General Electric Company Modular bus bar and switch assembly for traction inverter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3005945A (en) * 1958-10-27 1961-10-24 Chase Shawmut Co Semiconductor diode protection
DE1182352B (de) * 1960-09-21 1964-11-26 Siemens Ag Luftgekuehlte Halbleiter-Gleichrichtersaeule mit plattenfoermigen Gleichrichterelementen
DE2341097A1 (de) * 1973-08-14 1975-02-27 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147961A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 電子機器冷却装置およびこれを備える電力変換装置
WO2014147963A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 冷却装置及びこれを備えた電力変換装置
US9596791B2 (en) 2013-03-19 2017-03-14 Fuji Electric Co., Ltd. Cooling device and power converter having cooling device
US9832909B2 (en) 2013-03-19 2017-11-28 Fuji Electric Co., Ltd. Electronic equipment cooling device and power converter having electronic equipment cooling device

Also Published As

Publication number Publication date
US4460956A (en) 1984-07-17
AU555934B2 (en) 1986-10-16
AU8487282A (en) 1982-12-23
BR8203468A (pt) 1983-06-07
CA1190597A (en) 1985-07-16
JPS6311906Y2 (enExample) 1988-04-06

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