JPS57200048U - - Google Patents

Info

Publication number
JPS57200048U
JPS57200048U JP1981088271U JP8827181U JPS57200048U JP S57200048 U JPS57200048 U JP S57200048U JP 1981088271 U JP1981088271 U JP 1981088271U JP 8827181 U JP8827181 U JP 8827181U JP S57200048 U JPS57200048 U JP S57200048U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981088271U
Other languages
Japanese (ja)
Other versions
JPS6234467Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981088271U priority Critical patent/JPS6234467Y2/ja
Publication of JPS57200048U publication Critical patent/JPS57200048U/ja
Application granted granted Critical
Publication of JPS6234467Y2 publication Critical patent/JPS6234467Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
JP1981088271U 1981-06-15 1981-06-15 Expired JPS6234467Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981088271U JPS6234467Y2 (en:Method) 1981-06-15 1981-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981088271U JPS6234467Y2 (en:Method) 1981-06-15 1981-06-15

Publications (2)

Publication Number Publication Date
JPS57200048U true JPS57200048U (en:Method) 1982-12-20
JPS6234467Y2 JPS6234467Y2 (en:Method) 1987-09-02

Family

ID=29883451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981088271U Expired JPS6234467Y2 (en:Method) 1981-06-15 1981-06-15

Country Status (1)

Country Link
JP (1) JPS6234467Y2 (en:Method)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953668U (en:Method) * 1972-08-21 1974-05-11
JPS4985064U (en:Method) * 1972-11-10 1974-07-23
JPS52148055U (en:Method) * 1976-05-07 1977-11-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953668U (en:Method) * 1972-08-21 1974-05-11
JPS4985064U (en:Method) * 1972-11-10 1974-07-23
JPS52148055U (en:Method) * 1976-05-07 1977-11-09

Also Published As

Publication number Publication date
JPS6234467Y2 (en:Method) 1987-09-02

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