JPS57197891A - Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board - Google Patents

Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board

Info

Publication number
JPS57197891A
JPS57197891A JP8114381A JP8114381A JPS57197891A JP S57197891 A JPS57197891 A JP S57197891A JP 8114381 A JP8114381 A JP 8114381A JP 8114381 A JP8114381 A JP 8114381A JP S57197891 A JPS57197891 A JP S57197891A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
dry film
film resist
photosensitive dry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8114381A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0261024B2 (enrdf_load_stackoverflow
Inventor
Tadao Sano
Noboru Fujikawa
Mitsuo Kouno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Priority to JP8114381A priority Critical patent/JPS57197891A/ja
Publication of JPS57197891A publication Critical patent/JPS57197891A/ja
Publication of JPH0261024B2 publication Critical patent/JPH0261024B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP8114381A 1981-05-29 1981-05-29 Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board Granted JPS57197891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8114381A JPS57197891A (en) 1981-05-29 1981-05-29 Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8114381A JPS57197891A (en) 1981-05-29 1981-05-29 Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board

Publications (2)

Publication Number Publication Date
JPS57197891A true JPS57197891A (en) 1982-12-04
JPH0261024B2 JPH0261024B2 (enrdf_load_stackoverflow) 1990-12-18

Family

ID=13738184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8114381A Granted JPS57197891A (en) 1981-05-29 1981-05-29 Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS57197891A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103352A (ja) * 1983-11-11 1985-06-07 Tokyo Ohka Kogyo Co Ltd フオトレジスト形成用積層板製造装置
DE19618112A1 (de) * 1995-07-06 1997-01-09 Somar Corp Drehschneider
WO2000059275A1 (en) * 1999-03-26 2000-10-05 Matsushita Electric Works, Ltd. Method and system for processing metal-clad laminate for printed-circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176286B1 (en) 1998-07-16 2001-01-23 Somar Corporation Film applying apparatus
JP2003033971A (ja) * 2001-07-24 2003-02-04 Asahi Kasei Corp 感光性フィルムのラミネート方法
JP2006264017A (ja) * 2005-03-23 2006-10-05 Fuji Photo Film Co Ltd 積層体のラミネート方法及びラミネート装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103352A (ja) * 1983-11-11 1985-06-07 Tokyo Ohka Kogyo Co Ltd フオトレジスト形成用積層板製造装置
DE19618112A1 (de) * 1995-07-06 1997-01-09 Somar Corp Drehschneider
DE19618112C2 (de) * 1995-07-06 2000-07-06 Somar Corp Drehschneider
WO2000059275A1 (en) * 1999-03-26 2000-10-05 Matsushita Electric Works, Ltd. Method and system for processing metal-clad laminate for printed-circuit board

Also Published As

Publication number Publication date
JPH0261024B2 (enrdf_load_stackoverflow) 1990-12-18

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