JPS5719587B2 - - Google Patents
Info
- Publication number
- JPS5719587B2 JPS5719587B2 JP13232178A JP13232178A JPS5719587B2 JP S5719587 B2 JPS5719587 B2 JP S5719587B2 JP 13232178 A JP13232178 A JP 13232178A JP 13232178 A JP13232178 A JP 13232178A JP S5719587 B2 JPS5719587 B2 JP S5719587B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13232178A JPS5559796A (en) | 1978-10-27 | 1978-10-27 | Multilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13232178A JPS5559796A (en) | 1978-10-27 | 1978-10-27 | Multilayer printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5559796A JPS5559796A (en) | 1980-05-06 |
JPS5719587B2 true JPS5719587B2 (en) | 1982-04-23 |
Family
ID=15078573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13232178A Granted JPS5559796A (en) | 1978-10-27 | 1978-10-27 | Multilayer printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5559796A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017090181A1 (en) * | 2015-11-27 | 2018-09-06 | 富士通株式会社 | Circuit board and electronic device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136295A (en) * | 1983-12-23 | 1985-07-19 | セイコーエプソン株式会社 | Additive multilayer printed circuit board |
JPH0783185B2 (en) * | 1987-06-11 | 1995-09-06 | 松下電器産業株式会社 | High frequency circuit board |
JPH0424996A (en) * | 1990-05-15 | 1992-01-28 | Matsushita Electric Works Ltd | Manufacture of multilayer printed board |
JP4034888B2 (en) * | 1998-10-30 | 2008-01-16 | イビデン株式会社 | Test coupon on printed wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229453B2 (en) * | 1973-05-25 | 1977-08-02 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229453U (en) * | 1975-08-22 | 1977-03-01 |
-
1978
- 1978-10-27 JP JP13232178A patent/JPS5559796A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229453B2 (en) * | 1973-05-25 | 1977-08-02 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017090181A1 (en) * | 2015-11-27 | 2018-09-06 | 富士通株式会社 | Circuit board and electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPS5559796A (en) | 1980-05-06 |