JPS5719572B2 - - Google Patents
Info
- Publication number
- JPS5719572B2 JPS5719572B2 JP8471972A JP8471972A JPS5719572B2 JP S5719572 B2 JPS5719572 B2 JP S5719572B2 JP 8471972 A JP8471972 A JP 8471972A JP 8471972 A JP8471972 A JP 8471972A JP S5719572 B2 JPS5719572 B2 JP S5719572B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8471972A JPS5719572B2 (https=) | 1972-08-23 | 1972-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8471972A JPS5719572B2 (https=) | 1972-08-23 | 1972-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4940669A JPS4940669A (https=) | 1974-04-16 |
| JPS5719572B2 true JPS5719572B2 (https=) | 1982-04-23 |
Family
ID=13838475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8471972A Expired JPS5719572B2 (https=) | 1972-08-23 | 1972-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5719572B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272639A (ja) * | 1988-09-07 | 1990-03-12 | Rohm Co Ltd | ダイボンディング用半田層の形成方法 |
-
1972
- 1972-08-23 JP JP8471972A patent/JPS5719572B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4940669A (https=) | 1974-04-16 |