JPS57194558A - Heat radiating member - Google Patents

Heat radiating member

Info

Publication number
JPS57194558A
JPS57194558A JP56080258A JP8025881A JPS57194558A JP S57194558 A JPS57194558 A JP S57194558A JP 56080258 A JP56080258 A JP 56080258A JP 8025881 A JP8025881 A JP 8025881A JP S57194558 A JPS57194558 A JP S57194558A
Authority
JP
Japan
Prior art keywords
radiating
radiating member
members
heat radiating
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56080258A
Other languages
Japanese (ja)
Inventor
Mitsuya Koban
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56080258A priority Critical patent/JPS57194558A/en
Publication of JPS57194558A publication Critical patent/JPS57194558A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the radiating effect by a method wherein the first radiating member and the second radiating member are selected from each other by the specified gap and the third multiple radiating members are radially arranged within the gap so that the three radiating members may be formed into one body. CONSTITUTION:The first and the second radiating member 1 and 2 are separated from each other by the specified gap and the third multiple radiating members 3 are arranged respectively forming into one body. The cooling fan 5 is fixed to the central part of the second radiating member 2 by means of the metal fittings 6 which are further fixed to the second radiating member 2. Through these procedures, the radiating effect of these members may be remarkably improved.
JP56080258A 1981-05-27 1981-05-27 Heat radiating member Pending JPS57194558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56080258A JPS57194558A (en) 1981-05-27 1981-05-27 Heat radiating member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56080258A JPS57194558A (en) 1981-05-27 1981-05-27 Heat radiating member

Publications (1)

Publication Number Publication Date
JPS57194558A true JPS57194558A (en) 1982-11-30

Family

ID=13713284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56080258A Pending JPS57194558A (en) 1981-05-27 1981-05-27 Heat radiating member

Country Status (1)

Country Link
JP (1) JPS57194558A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090895U (en) * 1983-11-28 1985-06-21 株式会社ケンウッド Heat dissipation device for electronic equipment, etc.
JPH0412697U (en) * 1990-05-21 1992-01-31
USRE38382E1 (en) 1996-04-04 2004-01-13 Matsushita Electric Industrial Co., Ltd. Heat sink and electronic device employing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141320A (en) * 1975-05-30 1976-12-06 Mitsubishi Electric Corp Cooling device of solid state rectifier

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141320A (en) * 1975-05-30 1976-12-06 Mitsubishi Electric Corp Cooling device of solid state rectifier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090895U (en) * 1983-11-28 1985-06-21 株式会社ケンウッド Heat dissipation device for electronic equipment, etc.
JPH0223034Y2 (en) * 1983-11-28 1990-06-21
JPH0412697U (en) * 1990-05-21 1992-01-31
USRE38382E1 (en) 1996-04-04 2004-01-13 Matsushita Electric Industrial Co., Ltd. Heat sink and electronic device employing the same
USRE40369E1 (en) 1996-04-04 2008-06-10 Matsushita Electric Industrial Co., Ltd. Heat sink and electronic device employing the same

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