JPS57194541A - Integrated circuit - Google Patents
Integrated circuitInfo
- Publication number
- JPS57194541A JPS57194541A JP7953081A JP7953081A JPS57194541A JP S57194541 A JPS57194541 A JP S57194541A JP 7953081 A JP7953081 A JP 7953081A JP 7953081 A JP7953081 A JP 7953081A JP S57194541 A JPS57194541 A JP S57194541A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- integrated circuit
- indicated
- vicinity
- occupation area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/05624—Aluminium [Al] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To reduce the occupation area of the display pattern of the titled circuit by a method wherein the pad numbers of the integrated circuit are indicated by the binary numbered pattern provided in the vicinity of a pad. CONSTITUTION:The pad numbers are indicated by providing binary numbered patterns 1-5, wherein the difference between polycrystalline Si and Al is utilized, in the vicinity of the pad 6 on the integrated circuit. As a result, the occupation area of the display pattern can be reduced, and almost all the pad number which have heretofore been omitted due to having no space can be indicated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953081A JPS57194541A (en) | 1981-05-26 | 1981-05-26 | Integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953081A JPS57194541A (en) | 1981-05-26 | 1981-05-26 | Integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57194541A true JPS57194541A (en) | 1982-11-30 |
Family
ID=13692538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7953081A Pending JPS57194541A (en) | 1981-05-26 | 1981-05-26 | Integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57194541A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008008354A (en) * | 2006-06-28 | 2008-01-17 | Komatsu Ltd | Resin component fastening structure and construction machine exterior panel fastened using the same |
-
1981
- 1981-05-26 JP JP7953081A patent/JPS57194541A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008008354A (en) * | 2006-06-28 | 2008-01-17 | Komatsu Ltd | Resin component fastening structure and construction machine exterior panel fastened using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2043345B (en) | Fabrication of integrated circuits utilizing thick high-resolution patterns | |
KR860000712A (en) | Semiconductor integrated circuit and circuit pattern design method | |
AU4932485A (en) | Patterns on clothing | |
GB2155641B (en) | Pattern input apparatus | |
IL52304A (en) | Circuit arrangements for recognising colours | |
EP0026233A4 (en) | Semiconductor integrated circuit and wiring method therefor. | |
EP0187870A4 (en) | Pattern formation. | |
JPS57194541A (en) | Integrated circuit | |
GB8502574D0 (en) | Wafer scale integrated circuit | |
JPS5685784A (en) | Dot pattern readdin scheme | |
AU552037B2 (en) | Character dot pattern processing device | |
JPS5646572A (en) | Monolithic integrated circuit having twoo dimensional imageesensor | |
GB2008315B (en) | Charge-flow trasistors having metallization patterns | |
AU2013583A (en) | Dress pattern template | |
JPS53128232A (en) | Character pattern reduction method | |
JPS5296760A (en) | Processed rough rice | |
JPS52109387A (en) | Display unit | |
JPS52119260A (en) | Precious stone dial | |
JPS52120003A (en) | Sheet for pattern etching and etching method using same | |
JPS53130057A (en) | Inlay pattern body and forming method of the same | |
GB8329535D0 (en) | Forming pattern on substrate | |
JPS5794789A (en) | Dot pattern rotation circuit | |
JPS5369541A (en) | Graphic recognizing equipment | |
JPS5329022A (en) | Chinese-character panel equipment | |
JPS5382244A (en) | Method and circuit for recognizing pattern |