JPS57193048A - Semiconductor package for large power amplifier - Google Patents
Semiconductor package for large power amplifierInfo
- Publication number
- JPS57193048A JPS57193048A JP57067511A JP6751182A JPS57193048A JP S57193048 A JPS57193048 A JP S57193048A JP 57067511 A JP57067511 A JP 57067511A JP 6751182 A JP6751182 A JP 6751182A JP S57193048 A JPS57193048 A JP S57193048A
- Authority
- JP
- Japan
- Prior art keywords
- power amplifier
- semiconductor package
- large power
- package
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/181—Low-frequency amplifiers, e.g. audio preamplifiers
- H03F3/183—Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/26—Push-pull amplifiers; Phase-splitters therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Microwave Amplifiers (AREA)
- Amplifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25725981A | 1981-04-24 | 1981-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57193048A true JPS57193048A (en) | 1982-11-27 |
JPH0473322B2 JPH0473322B2 (en) | 1992-11-20 |
Family
ID=22975538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57067511A Granted JPS57193048A (en) | 1981-04-24 | 1982-04-23 | Semiconductor package for large power amplifier |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS57193048A (en) |
FR (1) | FR2504752A1 (en) |
NL (1) | NL8201668A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7649413B2 (en) | 2006-11-10 | 2010-01-19 | Kazumi Shiikuma | High-frequency power amplifier improved in size and cost |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996603A (en) * | 1974-10-18 | 1976-12-07 | Motorola, Inc. | RF power semiconductor package and method of manufacture |
-
1982
- 1982-04-22 NL NL8201668A patent/NL8201668A/en not_active Application Discontinuation
- 1982-04-23 FR FR8207052A patent/FR2504752A1/en not_active Withdrawn
- 1982-04-23 JP JP57067511A patent/JPS57193048A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996603A (en) * | 1974-10-18 | 1976-12-07 | Motorola, Inc. | RF power semiconductor package and method of manufacture |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7649413B2 (en) | 2006-11-10 | 2010-01-19 | Kazumi Shiikuma | High-frequency power amplifier improved in size and cost |
Also Published As
Publication number | Publication date |
---|---|
FR2504752A1 (en) | 1982-10-29 |
NL8201668A (en) | 1982-11-16 |
JPH0473322B2 (en) | 1992-11-20 |
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