JPS57188856A - Ebullition type cooling device - Google Patents

Ebullition type cooling device

Info

Publication number
JPS57188856A
JPS57188856A JP56074001A JP7400181A JPS57188856A JP S57188856 A JPS57188856 A JP S57188856A JP 56074001 A JP56074001 A JP 56074001A JP 7400181 A JP7400181 A JP 7400181A JP S57188856 A JPS57188856 A JP S57188856A
Authority
JP
Japan
Prior art keywords
cooling
condenser
allowable temperature
cooling system
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56074001A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137791B2 (enExample
Inventor
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56074001A priority Critical patent/JPS57188856A/ja
Publication of JPS57188856A publication Critical patent/JPS57188856A/ja
Publication of JPS6137791B2 publication Critical patent/JPS6137791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
JP56074001A 1981-05-15 1981-05-15 Ebullition type cooling device Granted JPS57188856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074001A JPS57188856A (en) 1981-05-15 1981-05-15 Ebullition type cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074001A JPS57188856A (en) 1981-05-15 1981-05-15 Ebullition type cooling device

Publications (2)

Publication Number Publication Date
JPS57188856A true JPS57188856A (en) 1982-11-19
JPS6137791B2 JPS6137791B2 (enExample) 1986-08-26

Family

ID=13534393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074001A Granted JPS57188856A (en) 1981-05-15 1981-05-15 Ebullition type cooling device

Country Status (1)

Country Link
JP (1) JPS57188856A (enExample)

Also Published As

Publication number Publication date
JPS6137791B2 (enExample) 1986-08-26

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