JPS57187948A - Wafer transferring device - Google Patents

Wafer transferring device

Info

Publication number
JPS57187948A
JPS57187948A JP7168381A JP7168381A JPS57187948A JP S57187948 A JPS57187948 A JP S57187948A JP 7168381 A JP7168381 A JP 7168381A JP 7168381 A JP7168381 A JP 7168381A JP S57187948 A JPS57187948 A JP S57187948A
Authority
JP
Japan
Prior art keywords
wafer
guide
carrier
comb
folding unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7168381A
Other languages
Japanese (ja)
Inventor
Takehito Miyazaki
Kiyoshi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7168381A priority Critical patent/JPS57187948A/en
Publication of JPS57187948A publication Critical patent/JPS57187948A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To transfer a wafer from a carrier to a quartz board automatically, by providing a guide to guide the wafer and a folding unit to have a block in which a rotating rod is buried at its top. CONSTITUTION:A wafer in a carrier holder 18 is guided by comb guides 20a, 20b at the top and bottom of frame retainer 19, and drops naturally to a quartz board, as a carrier holder 18 inclines. A comb guide 45 receives it at the top of pusher 41. The wafer received at the guide 45 is mounted on a folding unit 34. At the same time, its outer circle rotates in contact with a folding shaft 35. Each wafer is put in order on the condition the folded part is placed downward.
JP7168381A 1981-05-13 1981-05-13 Wafer transferring device Pending JPS57187948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7168381A JPS57187948A (en) 1981-05-13 1981-05-13 Wafer transferring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7168381A JPS57187948A (en) 1981-05-13 1981-05-13 Wafer transferring device

Publications (1)

Publication Number Publication Date
JPS57187948A true JPS57187948A (en) 1982-11-18

Family

ID=13467599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7168381A Pending JPS57187948A (en) 1981-05-13 1981-05-13 Wafer transferring device

Country Status (1)

Country Link
JP (1) JPS57187948A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173631A (en) * 1987-12-28 1989-07-10 Ohkura Electric Co Ltd Orienting device for wafer
KR100552282B1 (en) * 1997-12-31 2006-05-11 삼성전자주식회사 Automatic feeding device of glass substrate and method of using the same
JP2010090972A (en) * 2008-10-07 2010-04-22 Marui Sangyo Co Ltd Hanging bolt-supporting metal fitting for messenger wire

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173631A (en) * 1987-12-28 1989-07-10 Ohkura Electric Co Ltd Orienting device for wafer
KR100552282B1 (en) * 1997-12-31 2006-05-11 삼성전자주식회사 Automatic feeding device of glass substrate and method of using the same
JP2010090972A (en) * 2008-10-07 2010-04-22 Marui Sangyo Co Ltd Hanging bolt-supporting metal fitting for messenger wire

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