JPS57175092A - Method and device for laser working - Google Patents

Method and device for laser working

Info

Publication number
JPS57175092A
JPS57175092A JP56060660A JP6066081A JPS57175092A JP S57175092 A JPS57175092 A JP S57175092A JP 56060660 A JP56060660 A JP 56060660A JP 6066081 A JP6066081 A JP 6066081A JP S57175092 A JPS57175092 A JP S57175092A
Authority
JP
Japan
Prior art keywords
work
laser
working
difficult
end point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56060660A
Other languages
Japanese (ja)
Inventor
Tatsumi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56060660A priority Critical patent/JPS57175092A/en
Publication of JPS57175092A publication Critical patent/JPS57175092A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the accuracy and yield of working and to prevent chipping, cracking, etc. of a work by providing protecting bodies of a material which is difficult to be worked by laser in such a way as to abut on both side surfaces at the working start point and working end point of the work. CONSTITUTION:A work 13 is placed and fixed on a positioning table 12 which moves in arrow 11 directions, and the laser 14 from a laser oscillator 18 is condensed through a condenser lens 15 to the desired position of the work 13. Protecting bodies 21, 22 consisting of a material that is difficult to be worked by the laser 14 and or a material which is difficult to absorb the laser 14 are provided at the working start point 15 and working end point 17 of the work 13, and the positions 211, 221 of the bodies 21, 22 that contact the work 13 are inclined so as not to hamper the condensation of the laser 14. As a result, the laser 14 weakens at the point 16 and the working end point and therefore the heat capacity of the work 13 decreases and the accumulation of heat therein decreases; thus the chipping, crazing, cracking, etc. of the work 13 are obviated, and the accuracy and yield of working are improved.
JP56060660A 1981-04-23 1981-04-23 Method and device for laser working Pending JPS57175092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56060660A JPS57175092A (en) 1981-04-23 1981-04-23 Method and device for laser working

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56060660A JPS57175092A (en) 1981-04-23 1981-04-23 Method and device for laser working

Publications (1)

Publication Number Publication Date
JPS57175092A true JPS57175092A (en) 1982-10-27

Family

ID=13148710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56060660A Pending JPS57175092A (en) 1981-04-23 1981-04-23 Method and device for laser working

Country Status (1)

Country Link
JP (1) JPS57175092A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303899B1 (en) * 1998-12-11 2001-10-16 Lsi Logic Corporation Method and apparatus for scribing a code in an inactive outer clear out area of a semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303899B1 (en) * 1998-12-11 2001-10-16 Lsi Logic Corporation Method and apparatus for scribing a code in an inactive outer clear out area of a semiconductor wafer

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