JPS57168255U - - Google Patents
Info
- Publication number
- JPS57168255U JPS57168255U JP5512881U JP5512881U JPS57168255U JP S57168255 U JPS57168255 U JP S57168255U JP 5512881 U JP5512881 U JP 5512881U JP 5512881 U JP5512881 U JP 5512881U JP S57168255 U JPS57168255 U JP S57168255U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512881U JPS57168255U (cs) | 1981-04-16 | 1981-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512881U JPS57168255U (cs) | 1981-04-16 | 1981-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57168255U true JPS57168255U (cs) | 1982-10-23 |
Family
ID=29851691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5512881U Pending JPS57168255U (cs) | 1981-04-16 | 1981-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57168255U (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6335089U (cs) * | 1986-08-25 | 1988-03-07 | ||
| WO2006008883A1 (ja) * | 2004-07-22 | 2006-01-26 | Kabushiki Kaisha Yaskawa Denki | 反射形光学式検出器 |
| US12436479B2 (en) | 2020-12-10 | 2025-10-07 | Ricoh Company, Ltd. | Carrier for forming electrophotographic image, developer for forming electrophotographic image, electrophotographic image forming method, electrophotographic image forming apparatus, and process cartridge |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117014U (cs) * | 1974-07-25 | 1976-02-07 | ||
| JPS5315771B2 (cs) * | 1973-11-14 | 1978-05-27 |
-
1981
- 1981-04-16 JP JP5512881U patent/JPS57168255U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315771B2 (cs) * | 1973-11-14 | 1978-05-27 | ||
| JPS5117014U (cs) * | 1974-07-25 | 1976-02-07 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6335089U (cs) * | 1986-08-25 | 1988-03-07 | ||
| WO2006008883A1 (ja) * | 2004-07-22 | 2006-01-26 | Kabushiki Kaisha Yaskawa Denki | 反射形光学式検出器 |
| US12436479B2 (en) | 2020-12-10 | 2025-10-07 | Ricoh Company, Ltd. | Carrier for forming electrophotographic image, developer for forming electrophotographic image, electrophotographic image forming method, electrophotographic image forming apparatus, and process cartridge |