JPS5716758B2 - - Google Patents
Info
- Publication number
- JPS5716758B2 JPS5716758B2 JP9180875A JP9180875A JPS5716758B2 JP S5716758 B2 JPS5716758 B2 JP S5716758B2 JP 9180875 A JP9180875 A JP 9180875A JP 9180875 A JP9180875 A JP 9180875A JP S5716758 B2 JPS5716758 B2 JP S5716758B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9180875A JPS5214872A (en) | 1975-07-28 | 1975-07-28 | Method of manufacturing extremely thin copper foil for highhdensity printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9180875A JPS5214872A (en) | 1975-07-28 | 1975-07-28 | Method of manufacturing extremely thin copper foil for highhdensity printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5214872A JPS5214872A (en) | 1977-02-04 |
| JPS5716758B2 true JPS5716758B2 (fr) | 1982-04-07 |
Family
ID=14036913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9180875A Granted JPS5214872A (en) | 1975-07-28 | 1975-07-28 | Method of manufacturing extremely thin copper foil for highhdensity printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5214872A (fr) |
-
1975
- 1975-07-28 JP JP9180875A patent/JPS5214872A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5214872A (en) | 1977-02-04 |