JPS57166B2 - - Google Patents
Info
- Publication number
- JPS57166B2 JPS57166B2 JP3328874A JP3328874A JPS57166B2 JP S57166 B2 JPS57166 B2 JP S57166B2 JP 3328874 A JP3328874 A JP 3328874A JP 3328874 A JP3328874 A JP 3328874A JP S57166 B2 JPS57166 B2 JP S57166B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3328874A JPS57166B2 (de) | 1974-03-25 | 1974-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3328874A JPS57166B2 (de) | 1974-03-25 | 1974-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50126018A JPS50126018A (de) | 1975-10-03 |
| JPS57166B2 true JPS57166B2 (de) | 1982-01-05 |
Family
ID=12382335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3328874A Expired JPS57166B2 (de) | 1974-03-25 | 1974-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166B2 (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256558B2 (de) * | 1981-09-25 | 1990-11-30 | Rieter Ag Maschf | |
| JPH0469310B2 (de) * | 1984-08-30 | 1992-11-05 | Cefilac | |
| WO2017126520A1 (ja) | 2016-01-21 | 2017-07-27 | 三井化学株式会社 | 組成物、積層体、包材、電池ケース用包材および電池 |
| US11624009B2 (en) | 2016-12-22 | 2023-04-11 | Toagosei Co., Ltd. | Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866114A (de) * | 1971-12-10 | 1973-09-11 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127254Y2 (de) * | 1971-06-09 | 1976-07-10 | ||
| JPS5017954Y2 (de) * | 1971-11-15 | 1975-06-02 |
-
1974
- 1974-03-25 JP JP3328874A patent/JPS57166B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866114A (de) * | 1971-12-10 | 1973-09-11 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256558B2 (de) * | 1981-09-25 | 1990-11-30 | Rieter Ag Maschf | |
| JPH0469310B2 (de) * | 1984-08-30 | 1992-11-05 | Cefilac | |
| WO2017126520A1 (ja) | 2016-01-21 | 2017-07-27 | 三井化学株式会社 | 組成物、積層体、包材、電池ケース用包材および電池 |
| KR20180087365A (ko) | 2016-01-21 | 2018-08-01 | 미쓰이 가가쿠 가부시키가이샤 | 조성물, 적층체, 포재, 전지 케이스용 포재 및 전지 |
| US11624009B2 (en) | 2016-12-22 | 2023-04-11 | Toagosei Co., Ltd. | Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50126018A (de) | 1975-10-03 |