JPS5714024B2 - - Google Patents

Info

Publication number
JPS5714024B2
JPS5714024B2 JP12011273A JP12011273A JPS5714024B2 JP S5714024 B2 JPS5714024 B2 JP S5714024B2 JP 12011273 A JP12011273 A JP 12011273A JP 12011273 A JP12011273 A JP 12011273A JP S5714024 B2 JPS5714024 B2 JP S5714024B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12011273A
Other languages
Japanese (ja)
Other versions
JPS5071268A (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12011273A priority Critical patent/JPS5714024B2/ja
Priority to US05/517,307 priority patent/US3941985A/en
Publication of JPS5071268A publication Critical patent/JPS5071268A/ja
Publication of JPS5714024B2 publication Critical patent/JPS5714024B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP12011273A 1973-10-25 1973-10-25 Expired JPS5714024B2 (en:Method)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP12011273A JPS5714024B2 (en:Method) 1973-10-25 1973-10-25
US05/517,307 US3941985A (en) 1973-10-25 1974-10-23 Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12011273A JPS5714024B2 (en:Method) 1973-10-25 1973-10-25

Publications (2)

Publication Number Publication Date
JPS5071268A JPS5071268A (en:Method) 1975-06-13
JPS5714024B2 true JPS5714024B2 (en:Method) 1982-03-20

Family

ID=14778223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12011273A Expired JPS5714024B2 (en:Method) 1973-10-25 1973-10-25

Country Status (1)

Country Link
JP (1) JPS5714024B2 (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275101A (en) * 1976-12-20 1977-06-23 Toshiba Corp High frequency device
JPS61138247U (en:Method) * 1984-10-22 1986-08-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5647697B2 (en:Method) * 1973-06-26 1981-11-11

Also Published As

Publication number Publication date
JPS5071268A (en:Method) 1975-06-13

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