JPS57138576A - Lapping carrier - Google Patents

Lapping carrier

Info

Publication number
JPS57138576A
JPS57138576A JP56023734A JP2373481A JPS57138576A JP S57138576 A JPS57138576 A JP S57138576A JP 56023734 A JP56023734 A JP 56023734A JP 2373481 A JP2373481 A JP 2373481A JP S57138576 A JPS57138576 A JP S57138576A
Authority
JP
Japan
Prior art keywords
lapping carrier
section
gear
lapping
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56023734A
Other languages
Japanese (ja)
Inventor
Kunio Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP56023734A priority Critical patent/JPS57138576A/en
Publication of JPS57138576A publication Critical patent/JPS57138576A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To reduce the costs of material and machining of a lapping carrier by forming the lapping carrier that is used for two-face grinding machines, etc. into the gear section member and the sample holding section by division. CONSTITUTION:A lapping carrier 2 is divided into a member 21 that forms the gear section and a window section member 22 that has a window section 2a to put samples in, and those members 21 and 22 are machined separately and the groove 21' of the gear member 21 and the projection 22' of the window section member 22 are engaged as one body during use to form a lapping carrier 2.
JP56023734A 1981-02-20 1981-02-20 Lapping carrier Pending JPS57138576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56023734A JPS57138576A (en) 1981-02-20 1981-02-20 Lapping carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56023734A JPS57138576A (en) 1981-02-20 1981-02-20 Lapping carrier

Publications (1)

Publication Number Publication Date
JPS57138576A true JPS57138576A (en) 1982-08-26

Family

ID=12118532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56023734A Pending JPS57138576A (en) 1981-02-20 1981-02-20 Lapping carrier

Country Status (1)

Country Link
JP (1) JPS57138576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece

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