JPS5713804Y2 - - Google Patents

Info

Publication number
JPS5713804Y2
JPS5713804Y2 JP1975088814U JP8881475U JPS5713804Y2 JP S5713804 Y2 JPS5713804 Y2 JP S5713804Y2 JP 1975088814 U JP1975088814 U JP 1975088814U JP 8881475 U JP8881475 U JP 8881475U JP S5713804 Y2 JPS5713804 Y2 JP S5713804Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975088814U
Other languages
Japanese (ja)
Other versions
JPS524750U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975088814U priority Critical patent/JPS5713804Y2/ja
Publication of JPS524750U publication Critical patent/JPS524750U/ja
Application granted granted Critical
Publication of JPS5713804Y2 publication Critical patent/JPS5713804Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1975088814U 1975-06-24 1975-06-24 Expired JPS5713804Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975088814U JPS5713804Y2 (enrdf_load_html_response) 1975-06-24 1975-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975088814U JPS5713804Y2 (enrdf_load_html_response) 1975-06-24 1975-06-24

Publications (2)

Publication Number Publication Date
JPS524750U JPS524750U (enrdf_load_html_response) 1977-01-13
JPS5713804Y2 true JPS5713804Y2 (enrdf_load_html_response) 1982-03-19

Family

ID=28571087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975088814U Expired JPS5713804Y2 (enrdf_load_html_response) 1975-06-24 1975-06-24

Country Status (1)

Country Link
JP (1) JPS5713804Y2 (enrdf_load_html_response)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839860U (enrdf_load_html_response) * 1971-09-13 1973-05-18
JPS49149672U (enrdf_load_html_response) * 1973-04-26 1974-12-25

Also Published As

Publication number Publication date
JPS524750U (enrdf_load_html_response) 1977-01-13

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