JPS5713804Y2 - - Google Patents

Info

Publication number
JPS5713804Y2
JPS5713804Y2 JP1975088814U JP8881475U JPS5713804Y2 JP S5713804 Y2 JPS5713804 Y2 JP S5713804Y2 JP 1975088814 U JP1975088814 U JP 1975088814U JP 8881475 U JP8881475 U JP 8881475U JP S5713804 Y2 JPS5713804 Y2 JP S5713804Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975088814U
Other languages
Japanese (ja)
Other versions
JPS524750U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975088814U priority Critical patent/JPS5713804Y2/ja
Publication of JPS524750U publication Critical patent/JPS524750U/ja
Application granted granted Critical
Publication of JPS5713804Y2 publication Critical patent/JPS5713804Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1975088814U 1975-06-24 1975-06-24 Expired JPS5713804Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975088814U JPS5713804Y2 (cs) 1975-06-24 1975-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975088814U JPS5713804Y2 (cs) 1975-06-24 1975-06-24

Publications (2)

Publication Number Publication Date
JPS524750U JPS524750U (cs) 1977-01-13
JPS5713804Y2 true JPS5713804Y2 (cs) 1982-03-19

Family

ID=28571087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975088814U Expired JPS5713804Y2 (cs) 1975-06-24 1975-06-24

Country Status (1)

Country Link
JP (1) JPS5713804Y2 (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839860U (cs) * 1971-09-13 1973-05-18
JPS49149672U (cs) * 1973-04-26 1974-12-25

Also Published As

Publication number Publication date
JPS524750U (cs) 1977-01-13

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