JPS57135735U - - Google Patents
Info
- Publication number
- JPS57135735U JPS57135735U JP1981022138U JP2213881U JPS57135735U JP S57135735 U JPS57135735 U JP S57135735U JP 1981022138 U JP1981022138 U JP 1981022138U JP 2213881 U JP2213881 U JP 2213881U JP S57135735 U JPS57135735 U JP S57135735U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981022138U JPS57135735U (enExample) | 1981-02-20 | 1981-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981022138U JPS57135735U (enExample) | 1981-02-20 | 1981-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57135735U true JPS57135735U (enExample) | 1982-08-24 |
Family
ID=29819954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981022138U Pending JPS57135735U (enExample) | 1981-02-20 | 1981-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57135735U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5473562A (en) * | 1977-11-24 | 1979-06-12 | Hitachi Ltd | Wire bonding device |
| JPS54149577A (en) * | 1978-05-17 | 1979-11-22 | Hitachi Ltd | Ultrasonic wire bonder |
-
1981
- 1981-02-20 JP JP1981022138U patent/JPS57135735U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5473562A (en) * | 1977-11-24 | 1979-06-12 | Hitachi Ltd | Wire bonding device |
| JPS54149577A (en) * | 1978-05-17 | 1979-11-22 | Hitachi Ltd | Ultrasonic wire bonder |