JPS57128177U - - Google Patents
Info
- Publication number
- JPS57128177U JPS57128177U JP1475181U JP1475181U JPS57128177U JP S57128177 U JPS57128177 U JP S57128177U JP 1475181 U JP1475181 U JP 1475181U JP 1475181 U JP1475181 U JP 1475181U JP S57128177 U JPS57128177 U JP S57128177U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1475181U JPS57128177U (ja) | 1981-02-04 | 1981-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1475181U JPS57128177U (ja) | 1981-02-04 | 1981-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57128177U true JPS57128177U (ja) | 1982-08-10 |
Family
ID=29812782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1475181U Pending JPS57128177U (ja) | 1981-02-04 | 1981-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128177U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5532049B2 (ja) * | 2009-08-31 | 2014-06-25 | 富士通株式会社 | 電子機器 |
| CN113205961A (zh) * | 2020-02-03 | 2021-08-03 | Tdk株式会社 | 电子部件安装结构 |
-
1981
- 1981-02-04 JP JP1475181U patent/JPS57128177U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5532049B2 (ja) * | 2009-08-31 | 2014-06-25 | 富士通株式会社 | 電子機器 |
| CN113205961A (zh) * | 2020-02-03 | 2021-08-03 | Tdk株式会社 | 电子部件安装结构 |
| JP2021125510A (ja) * | 2020-02-03 | 2021-08-30 | Tdk株式会社 | 電子部品実装構造 |
| CN113205961B (zh) * | 2020-02-03 | 2023-04-07 | Tdk株式会社 | 电子部件安装结构 |