JPS5712747U - - Google Patents
Info
- Publication number
- JPS5712747U JPS5712747U JP8796580U JP8796580U JPS5712747U JP S5712747 U JPS5712747 U JP S5712747U JP 8796580 U JP8796580 U JP 8796580U JP 8796580 U JP8796580 U JP 8796580U JP S5712747 U JPS5712747 U JP S5712747U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8796580U JPS5712747U (enExample) | 1980-06-25 | 1980-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8796580U JPS5712747U (enExample) | 1980-06-25 | 1980-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5712747U true JPS5712747U (enExample) | 1982-01-22 |
Family
ID=29450056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8796580U Pending JPS5712747U (enExample) | 1980-06-25 | 1980-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5712747U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024040777A (ja) * | 2022-09-13 | 2024-03-26 | 株式会社東芝 | リードフレームおよび半導体装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010966A (enExample) * | 1973-05-28 | 1975-02-04 | ||
| JPS5011770A (enExample) * | 1973-06-04 | 1975-02-06 | ||
| JPS5013877A (enExample) * | 1973-06-12 | 1975-02-13 |
-
1980
- 1980-06-25 JP JP8796580U patent/JPS5712747U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010966A (enExample) * | 1973-05-28 | 1975-02-04 | ||
| JPS5011770A (enExample) * | 1973-06-04 | 1975-02-06 | ||
| JPS5013877A (enExample) * | 1973-06-12 | 1975-02-13 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024040777A (ja) * | 2022-09-13 | 2024-03-26 | 株式会社東芝 | リードフレームおよび半導体装置 |