Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP14381376ApriorityCriticalpatent/JPS5368073A/ja
Publication of JPS5368073ApublicationCriticalpatent/JPS5368073A/ja
Publication of JPS5712533B2publicationCriticalpatent/JPS5712533B2/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W90/00—Package configurations
H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
Wire Bonding
(AREA)
JP14381376A1976-11-291976-11-29Method of heating lead frame
GrantedJPS5368073A
(en)