JPS5712298B2 - - Google Patents

Info

Publication number
JPS5712298B2
JPS5712298B2 JP9721874A JP9721874A JPS5712298B2 JP S5712298 B2 JPS5712298 B2 JP S5712298B2 JP 9721874 A JP9721874 A JP 9721874A JP 9721874 A JP9721874 A JP 9721874A JP S5712298 B2 JPS5712298 B2 JP S5712298B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9721874A
Other versions
JPS5124870A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9721874A priority Critical patent/JPS5124870A/ja
Publication of JPS5124870A publication Critical patent/JPS5124870A/ja
Publication of JPS5712298B2 publication Critical patent/JPS5712298B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP9721874A 1974-08-23 1974-08-23 Handotaisochi Granted JPS5124870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9721874A JPS5124870A (en) 1974-08-23 1974-08-23 Handotaisochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9721874A JPS5124870A (en) 1974-08-23 1974-08-23 Handotaisochi

Publications (2)

Publication Number Publication Date
JPS5124870A JPS5124870A (en) 1976-02-28
JPS5712298B2 true JPS5712298B2 (ja) 1982-03-10

Family

ID=14186475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9721874A Granted JPS5124870A (en) 1974-08-23 1974-08-23 Handotaisochi

Country Status (1)

Country Link
JP (1) JPS5124870A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592497U (ja) * 1982-06-30 1984-01-09 松下電工株式会社 汚水処理装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57180167A (en) * 1981-04-28 1982-11-06 Siemens Ag Thyristor
EP0266093B1 (en) * 1986-10-27 1992-09-23 Electric Power Research Institute, Inc Process of making a high power multi-layer semiconductive switching device with multiple parallel contacts
JPH0485259U (ja) * 1990-11-30 1992-07-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592497U (ja) * 1982-06-30 1984-01-09 松下電工株式会社 汚水処理装置

Also Published As

Publication number Publication date
JPS5124870A (en) 1976-02-28

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