JPS57119577U - - Google Patents
Info
- Publication number
- JPS57119577U JPS57119577U JP461781U JP461781U JPS57119577U JP S57119577 U JPS57119577 U JP S57119577U JP 461781 U JP461781 U JP 461781U JP 461781 U JP461781 U JP 461781U JP S57119577 U JPS57119577 U JP S57119577U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP461781U JPS57119577U (en) | 1981-01-17 | 1981-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP461781U JPS57119577U (en) | 1981-01-17 | 1981-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57119577U true JPS57119577U (en) | 1982-07-24 |
Family
ID=29803030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP461781U Pending JPS57119577U (en) | 1981-01-17 | 1981-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57119577U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059757A (en) * | 1983-09-13 | 1985-04-06 | Fujitsu Ltd | Heat sink |
| JPH0523569U (en) * | 1991-09-04 | 1993-03-26 | 日本電気株式会社 | Printed circuit board pattern structure |
| JP2011100987A (en) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | Wiring board |
| DE102017210654A1 (en) * | 2017-06-23 | 2018-12-27 | Infineon Technologies Ag | An electronic device comprising a rewiring layer pad comprising a cavity |
-
1981
- 1981-01-17 JP JP461781U patent/JPS57119577U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059757A (en) * | 1983-09-13 | 1985-04-06 | Fujitsu Ltd | Heat sink |
| JPH0523569U (en) * | 1991-09-04 | 1993-03-26 | 日本電気株式会社 | Printed circuit board pattern structure |
| JP2011100987A (en) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | Wiring board |
| DE102017210654A1 (en) * | 2017-06-23 | 2018-12-27 | Infineon Technologies Ag | An electronic device comprising a rewiring layer pad comprising a cavity |
| CN109119399A (en) * | 2017-06-23 | 2019-01-01 | 英飞凌科技股份有限公司 | Electronic device including the redistributing layer pad comprising gap |
| US10916484B2 (en) | 2017-06-23 | 2021-02-09 | Infineon Technologies Ag | Electronic device including redistribution layer pad having a void |
| DE102017210654B4 (en) | 2017-06-23 | 2022-06-09 | Infineon Technologies Ag | An electronic device comprising a redistribution layer pad comprising a cavity |