JPS57118882A - Laser cutting method - Google Patents

Laser cutting method

Info

Publication number
JPS57118882A
JPS57118882A JP56005022A JP502281A JPS57118882A JP S57118882 A JPS57118882 A JP S57118882A JP 56005022 A JP56005022 A JP 56005022A JP 502281 A JP502281 A JP 502281A JP S57118882 A JPS57118882 A JP S57118882A
Authority
JP
Japan
Prior art keywords
low temperature
gas
cutting part
cooled
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56005022A
Other languages
Japanese (ja)
Inventor
Noboru Kashimura
Munenobu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56005022A priority Critical patent/JPS57118882A/en
Publication of JPS57118882A publication Critical patent/JPS57118882A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To reduce thermally influenced layer at the cutting part in cutting a plastics material with a laser beam by preliminarily cooling auxiliary gas that is sprayed to the cutting part into low temperature. CONSTITUTION:A work 4 made of plastics is cut by a working head that irradiates a laser beam 2 converged by a condenser 3. At this time, compressed gas 7 of auxiliary gas such as air, argon, nitrogen etc. is cooled by a low temperature generator 8 and supplied from an inlet 9 of the working head 1 as low temperature auxiliary gas. The periphery of the cutting part of work 4 is cooled by the gas, and contaminations such as evaporation gas, molten substance etc. generated at the time of cutting are blown off and removed. The periphery of cutting part of the work 4 is cooled by low temperature auxiliary gas and the thermally influenced layer is reduced.
JP56005022A 1981-01-19 1981-01-19 Laser cutting method Pending JPS57118882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56005022A JPS57118882A (en) 1981-01-19 1981-01-19 Laser cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56005022A JPS57118882A (en) 1981-01-19 1981-01-19 Laser cutting method

Publications (1)

Publication Number Publication Date
JPS57118882A true JPS57118882A (en) 1982-07-23

Family

ID=11599876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56005022A Pending JPS57118882A (en) 1981-01-19 1981-01-19 Laser cutting method

Country Status (1)

Country Link
JP (1) JPS57118882A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005095042A1 (en) * 2004-03-31 2005-10-13 Nikon Corporation Processing method for organic crystal, processing device for organic crystal, and observing device for organic crystal
US7356240B2 (en) 2003-09-11 2008-04-08 Nikon Corporation Processing method of polymer crystal, processing system of polymer crystal, and observation system of polymer crystal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7356240B2 (en) 2003-09-11 2008-04-08 Nikon Corporation Processing method of polymer crystal, processing system of polymer crystal, and observation system of polymer crystal
WO2005095042A1 (en) * 2004-03-31 2005-10-13 Nikon Corporation Processing method for organic crystal, processing device for organic crystal, and observing device for organic crystal
JP4739188B2 (en) * 2004-03-31 2011-08-03 株式会社ニコン Organic crystal processing method, organic crystal processing apparatus, and organic crystal observation apparatus
US8016940B2 (en) 2004-03-31 2011-09-13 Nikon Corporation Processing method for organic crystal, processing device for organic crystal, and observing device for organic crystal

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