JPS57115255U - - Google Patents

Info

Publication number
JPS57115255U
JPS57115255U JP157981U JP157981U JPS57115255U JP S57115255 U JPS57115255 U JP S57115255U JP 157981 U JP157981 U JP 157981U JP 157981 U JP157981 U JP 157981U JP S57115255 U JPS57115255 U JP S57115255U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP157981U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP157981U priority Critical patent/JPS57115255U/ja
Publication of JPS57115255U publication Critical patent/JPS57115255U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP157981U 1981-01-08 1981-01-08 Pending JPS57115255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP157981U JPS57115255U (en) 1981-01-08 1981-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP157981U JPS57115255U (en) 1981-01-08 1981-01-08

Publications (1)

Publication Number Publication Date
JPS57115255U true JPS57115255U (en) 1982-07-16

Family

ID=29800030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP157981U Pending JPS57115255U (en) 1981-01-08 1981-01-08

Country Status (1)

Country Link
JP (1) JPS57115255U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157826A (en) * 2005-12-01 2007-06-21 Oki Electric Ind Co Ltd Semiconductor device, manufacturing method thereof, and lead frame thereof
JP2008027994A (en) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157826A (en) * 2005-12-01 2007-06-21 Oki Electric Ind Co Ltd Semiconductor device, manufacturing method thereof, and lead frame thereof
JP2008027994A (en) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method therefor

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