JPS57114262A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS57114262A
JPS57114262A JP58581A JP58581A JPS57114262A JP S57114262 A JPS57114262 A JP S57114262A JP 58581 A JP58581 A JP 58581A JP 58581 A JP58581 A JP 58581A JP S57114262 A JPS57114262 A JP S57114262A
Authority
JP
Japan
Prior art keywords
projection
frame
lead
bent part
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58581A
Other languages
Japanese (ja)
Inventor
Koji Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58581A priority Critical patent/JPS57114262A/en
Publication of JPS57114262A publication Critical patent/JPS57114262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To eliminate the displacement of the end of an inner lead to effectively detect the position of an automatic bonder by providing a projection or a bent part on the outer frame for connecting the lead. CONSTITUTION:A solder-shaped projection 4, a small projection or a bent part is formed by pressing at the outer supporting frame 3 of a lead frame. In this manner, even if a strain takes place in a frame blank, or even if a strain due to pressing is produced, the lead frame becomes sufficiently rigid by the projection or bent part, thereby preventing the displacement of the end of the inner lead due to the deformation.
JP58581A 1981-01-06 1981-01-06 Lead frame Pending JPS57114262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58581A JPS57114262A (en) 1981-01-06 1981-01-06 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58581A JPS57114262A (en) 1981-01-06 1981-01-06 Lead frame

Publications (1)

Publication Number Publication Date
JPS57114262A true JPS57114262A (en) 1982-07-16

Family

ID=11477790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58581A Pending JPS57114262A (en) 1981-01-06 1981-01-06 Lead frame

Country Status (1)

Country Link
JP (1) JPS57114262A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63185051A (en) * 1987-01-27 1988-07-30 Nec Kyushu Ltd Ceramic package for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63185051A (en) * 1987-01-27 1988-07-30 Nec Kyushu Ltd Ceramic package for semiconductor device

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