JPS571140B2 - - Google Patents
Info
- Publication number
- JPS571140B2 JPS571140B2 JP2026576A JP2026576A JPS571140B2 JP S571140 B2 JPS571140 B2 JP S571140B2 JP 2026576 A JP2026576 A JP 2026576A JP 2026576 A JP2026576 A JP 2026576A JP S571140 B2 JPS571140 B2 JP S571140B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026576A JPS52103959A (en) | 1976-02-26 | 1976-02-26 | Leadframe for semiconductor and method of manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026576A JPS52103959A (en) | 1976-02-26 | 1976-02-26 | Leadframe for semiconductor and method of manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52103959A JPS52103959A (en) | 1977-08-31 |
| JPS571140B2 true JPS571140B2 (it) | 1982-01-09 |
Family
ID=12022356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026576A Granted JPS52103959A (en) | 1976-02-26 | 1976-02-26 | Leadframe for semiconductor and method of manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52103959A (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169056U (ja) * | 1982-05-06 | 1983-11-11 | 東静容器株式会社 | 容器のふた |
-
1976
- 1976-02-26 JP JP2026576A patent/JPS52103959A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169056U (ja) * | 1982-05-06 | 1983-11-11 | 東静容器株式会社 | 容器のふた |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52103959A (en) | 1977-08-31 |