JPS57113236A - Position indicating system - Google Patents

Position indicating system

Info

Publication number
JPS57113236A
JPS57113236A JP55189534A JP18953480A JPS57113236A JP S57113236 A JPS57113236 A JP S57113236A JP 55189534 A JP55189534 A JP 55189534A JP 18953480 A JP18953480 A JP 18953480A JP S57113236 A JPS57113236 A JP S57113236A
Authority
JP
Japan
Prior art keywords
image
sample
projected
mark
position indicating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55189534A
Other languages
English (en)
Inventor
Masahito Nakajima
Tetsuo Hizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55189534A priority Critical patent/JPS57113236A/ja
Publication of JPS57113236A publication Critical patent/JPS57113236A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
  • Wire Bonding (AREA)
JP55189534A 1980-12-30 1980-12-30 Position indicating system Pending JPS57113236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55189534A JPS57113236A (en) 1980-12-30 1980-12-30 Position indicating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55189534A JPS57113236A (en) 1980-12-30 1980-12-30 Position indicating system

Publications (1)

Publication Number Publication Date
JPS57113236A true JPS57113236A (en) 1982-07-14

Family

ID=16242905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55189534A Pending JPS57113236A (en) 1980-12-30 1980-12-30 Position indicating system

Country Status (1)

Country Link
JP (1) JPS57113236A (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146070A (ja) * 1974-10-18 1976-04-20 Hitachi Ltd
JPS54115068A (en) * 1978-02-28 1979-09-07 Shinkawa Seisakusho Kk Device for positioning pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146070A (ja) * 1974-10-18 1976-04-20 Hitachi Ltd
JPS54115068A (en) * 1978-02-28 1979-09-07 Shinkawa Seisakusho Kk Device for positioning pattern

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