JPS5711141A - Outrigger operating circuit for mobile crane - Google Patents

Outrigger operating circuit for mobile crane

Info

Publication number
JPS5711141A
JPS5711141A JP8469880A JP8469880A JPS5711141A JP S5711141 A JPS5711141 A JP S5711141A JP 8469880 A JP8469880 A JP 8469880A JP 8469880 A JP8469880 A JP 8469880A JP S5711141 A JPS5711141 A JP S5711141A
Authority
JP
Japan
Prior art keywords
vehicle body
horizontal
held
switch
cylinders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8469880A
Other languages
Japanese (ja)
Inventor
Miyuki Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to JP8469880A priority Critical patent/JPS5711141A/en
Publication of JPS5711141A publication Critical patent/JPS5711141A/en
Pending legal-status Critical Current

Links

Landscapes

  • Vehicle Cleaning, Maintenance, Repair, Refitting, And Outriggers (AREA)
  • Jib Cranes (AREA)

Abstract

PURPOSE: To prevent the vehicle body from tilting and falling, and install it efficiently in the hoisting condition in such a way that two jack cylinders are paired, these are constantly controlled to extend and contract in parallel in response to the tilting direction of the vehicle body in order to hold it in horizontal.
CONSTITUTION: In order to float up the vehicle body, at the same time as an electromagnetic valve 15 is changed over to the side of position 15A by changing over a switch SW1 to the side of contact Sa, valves 11 to 14 are changed over to the position 11A to 14A by turning switches SW2, SW3. In result, pressured oil is fed into each cylinder 1 to 4, and the vehicle body is floated up. When the switches SW2, SW3 are turned off, the vehicle body is held in floating position. In case where the vehicle body is not held in horizontal, for example the side supported by the cylinders 1, 2 are lowly titled, the valves 11, 12 are changed over to the positions 11A, 12A by turning on the switch SW2 only, so that the cylinders 1, 2 can be extended. In result, in proportion as tilting dwindles, the vehicle body becomes horizontal when the switch SW2 is turned off, the vehicle body is held in horizontal. The same will be given also for other cases.
COPYRIGHT: (C)1982,JPO&Japio
JP8469880A 1980-06-23 1980-06-23 Outrigger operating circuit for mobile crane Pending JPS5711141A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8469880A JPS5711141A (en) 1980-06-23 1980-06-23 Outrigger operating circuit for mobile crane

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8469880A JPS5711141A (en) 1980-06-23 1980-06-23 Outrigger operating circuit for mobile crane

Publications (1)

Publication Number Publication Date
JPS5711141A true JPS5711141A (en) 1982-01-20

Family

ID=13837878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8469880A Pending JPS5711141A (en) 1980-06-23 1980-06-23 Outrigger operating circuit for mobile crane

Country Status (1)

Country Link
JP (1) JPS5711141A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950623A (en) * 1988-08-02 1990-08-21 Microelectronics Center Of North Carolina Method of building solder bumps
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5767010A (en) * 1995-03-20 1998-06-16 Mcnc Solder bump fabrication methods and structure including a titanium barrier layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950623A (en) * 1988-08-02 1990-08-21 Microelectronics Center Of North Carolina Method of building solder bumps
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5374893A (en) * 1992-03-04 1994-12-20 Mcnc Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon
US5381946A (en) * 1992-03-04 1995-01-17 Mcnc Method of forming differing volume solder bumps
US5767010A (en) * 1995-03-20 1998-06-16 Mcnc Solder bump fabrication methods and structure including a titanium barrier layer
US6222279B1 (en) 1995-03-20 2001-04-24 Mcnc Solder bump fabrication methods and structures including a titanium barrier layer

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