JPS5711141A - Outrigger operating circuit for mobile crane - Google Patents
Outrigger operating circuit for mobile craneInfo
- Publication number
- JPS5711141A JPS5711141A JP8469880A JP8469880A JPS5711141A JP S5711141 A JPS5711141 A JP S5711141A JP 8469880 A JP8469880 A JP 8469880A JP 8469880 A JP8469880 A JP 8469880A JP S5711141 A JPS5711141 A JP S5711141A
- Authority
- JP
- Japan
- Prior art keywords
- vehicle body
- horizontal
- held
- switch
- cylinders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Vehicle Cleaning, Maintenance, Repair, Refitting, And Outriggers (AREA)
- Jib Cranes (AREA)
Abstract
PURPOSE: To prevent the vehicle body from tilting and falling, and install it efficiently in the hoisting condition in such a way that two jack cylinders are paired, these are constantly controlled to extend and contract in parallel in response to the tilting direction of the vehicle body in order to hold it in horizontal.
CONSTITUTION: In order to float up the vehicle body, at the same time as an electromagnetic valve 15 is changed over to the side of position 15A by changing over a switch SW1 to the side of contact Sa, valves 11 to 14 are changed over to the position 11A to 14A by turning switches SW2, SW3. In result, pressured oil is fed into each cylinder 1 to 4, and the vehicle body is floated up. When the switches SW2, SW3 are turned off, the vehicle body is held in floating position. In case where the vehicle body is not held in horizontal, for example the side supported by the cylinders 1, 2 are lowly titled, the valves 11, 12 are changed over to the positions 11A, 12A by turning on the switch SW2 only, so that the cylinders 1, 2 can be extended. In result, in proportion as tilting dwindles, the vehicle body becomes horizontal when the switch SW2 is turned off, the vehicle body is held in horizontal. The same will be given also for other cases.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8469880A JPS5711141A (en) | 1980-06-23 | 1980-06-23 | Outrigger operating circuit for mobile crane |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8469880A JPS5711141A (en) | 1980-06-23 | 1980-06-23 | Outrigger operating circuit for mobile crane |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5711141A true JPS5711141A (en) | 1982-01-20 |
Family
ID=13837878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8469880A Pending JPS5711141A (en) | 1980-06-23 | 1980-06-23 | Outrigger operating circuit for mobile crane |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5711141A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
-
1980
- 1980-06-23 JP JP8469880A patent/JPS5711141A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
US5374893A (en) * | 1992-03-04 | 1994-12-20 | Mcnc | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US5381946A (en) * | 1992-03-04 | 1995-01-17 | Mcnc | Method of forming differing volume solder bumps |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
US6222279B1 (en) | 1995-03-20 | 2001-04-24 | Mcnc | Solder bump fabrication methods and structures including a titanium barrier layer |
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