JPS57111039A - Wire clamper - Google Patents

Wire clamper

Info

Publication number
JPS57111039A
JPS57111039A JP18604580A JP18604580A JPS57111039A JP S57111039 A JPS57111039 A JP S57111039A JP 18604580 A JP18604580 A JP 18604580A JP 18604580 A JP18604580 A JP 18604580A JP S57111039 A JPS57111039 A JP S57111039A
Authority
JP
Japan
Prior art keywords
clamping
arm
impact
clamping plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18604580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS612294B2 (https=
Inventor
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP18604580A priority Critical patent/JPS57111039A/ja
Publication of JPS57111039A publication Critical patent/JPS57111039A/ja
Publication of JPS612294B2 publication Critical patent/JPS612294B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP18604580A 1980-12-27 1980-12-27 Wire clamper Granted JPS57111039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18604580A JPS57111039A (en) 1980-12-27 1980-12-27 Wire clamper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18604580A JPS57111039A (en) 1980-12-27 1980-12-27 Wire clamper

Publications (2)

Publication Number Publication Date
JPS57111039A true JPS57111039A (en) 1982-07-10
JPS612294B2 JPS612294B2 (https=) 1986-01-23

Family

ID=16181429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18604580A Granted JPS57111039A (en) 1980-12-27 1980-12-27 Wire clamper

Country Status (1)

Country Link
JP (1) JPS57111039A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63143391U (https=) * 1987-03-11 1988-09-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド

Also Published As

Publication number Publication date
JPS612294B2 (https=) 1986-01-23

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